Services

Services

Kuva

Our expertise and facilities allow the following:

  • Detector development (Gas Electron Multipliers, GEMs and Silicon Pixel/Strip Detectors)
  • Wire and Flip-Chip bonding
  • Bond quality analysis, with pull tests and optically
  • Fast environmental testing (15 K/min, -70/+150 degrees, 10-90 RH%, MIL standards)
  • Wafer/chip probe-measurement
  • Prototype assembly
  • Surface analysis, by profilometer
  • Current-voltage / capacitance-voltage characterization
  • Quality Assurance by optical scanning